What is slice processing?
If you have any issues with cutting techniques for various materials, please feel free to contact us!
At Shinco Manufacturing Co., Ltd., we perform "slicing processing." The cutting technology that started with a wire diameter of 120μm and diamond sizes of 15-25μm (total cutting allowance of 150μm) has now been reduced to a wire diameter of φ60μm and diamond sizes of 6-12μm (total cutting allowance of 75μm), which is half of what it was at that time. Currently, we are receiving positive feedback from customers both domestically and internationally, and we are expanding our fixed abrasive cutting technology, developed through silicon wafer processing for solar cells, into new markets. If you have any issues with cutting technology for various materials, we offer both free abrasive and fixed abrasive methods, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.
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