[Seminar] Basics of Semiconductor Packaging and Manufacturing Process
We will cover the meaning of structure, its relationship with implementation technology, and manufacturing challenges in one day!
We will hold a seminar titled "Fundamentals of Semiconductor Packaging, Manufacturing Processes, Challenges, and Latest Technological Trends" to leverage for equipment and material development. From the basics of semiconductor packaging to the overall picture of the backend processes, and including flip chip, WLP, FOWLP, and 3D packaging, you will systematically acquire knowledge at the forefront of evolution. This special seminar is essential for young and mid-career engineers involved in material/device development and process design, providing practical insights into the overall picture of packaging technology. We sincerely look forward to your participation. 【Seminar Overview (Partial)】 ■ Date: September 4, 2025 (Thursday) 10:00 AM - 4:00 PM ■ Venue: Online only (Zoom system) ■ Participation Fee (including tax): 49,500 yen per person ■ Course Materials: PDF materials (included in the participation fee) *Please apply early as the registration will close once the capacity is reached.
basic information
【Acquired Knowledge】 ■ Able to understand the functions required of semiconductor packages ■ Able to understand the structure, types, and evolution of semiconductor packages ■ Able to understand the assembly process of semiconductor packages ■ Able to know the trends in packaging *Please apply early as the deadline will be closed once the capacity is reached.
Price range
P2
Delivery Time
OTHER
Applications/Examples of results
Please apply as soon as possible, as the application will close once the capacity is reached.
