SPI inspection device 'KY8030-3'
A SPI inspection device capable of detecting a wide range of defects with realistic images and 3D data!
The "KY8030-3" is an SPI inspection device that achieves true 3D inspection without worrying about uncertainties caused by shadow issues. It allows for real-time measurement and correction of warping of the substrate against an ideal plane, as well as real-time matching of the positions of PCB pads defined by CAD files in the ideal PCB stencil design. Additionally, it enables extensive defect detection using realistic images and 3D data. 【Features】 ■ Real-time warping correction ■ User-friendly software ■ SMT process management system with a 3D database *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Main Specifications (Excerpt)】 <Inspection Items> ■ Camera Resolution: 10µm, 15µm, 20µm ■ Camera: 4M Pixel High-Speed Camera ■ Height Measurement Accuracy (based on Koyon standard target): 1µm ■ Maximum Pad Size: 10×10mm ■ Maximum Pad Height: 400μm ■ Minimum Pad Spacing: 100μm (based on 150μm pad height) ■ Influence of Substrate Color: None *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■Production site *For more details, please refer to the PDF document or feel free to contact us.
