Ultrasonic vibration, sweep vibration
Artec's latest technology, "Variable Frequency Band" method.
The ultrasonic vibration that oscillates back and forth 1 to 100 times per second (configurable) within the frequency range of 33kHz to 37kHz (configurable) applied from the ultrasonic oscillator to the converter is called sweep vibration. 【Features】 ○ Not affected by the natural frequency of the ring, generating no strong or weak wave patterns on the screen surface due to complex frequency vibrations. ○ Enables stable amplitude vibration operation with higher sifting efficiency than conventional methods. ○ Can vibrate even with multiple rings. ● For more details, please contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.