Precision machining case study of core pins for molding in the semiconductor industry.

Processing and treatment are carried out through die-sinking electrical discharge machining and polishing. Examples of production for the semiconductor industry.

WTM Corporation has a track record of sourcing precision machined parts of Japanese quality from overseas for 18 years. We respond with heartfelt service to "a wide variety and from a single item," managing everything from procurement sources to processes and inspections in a comprehensive manner. This time, we would like to introduce a case study of manufacturing core pins for molding used in semiconductors. The processing and treatment were carried out through electrical discharge machining and polishing. The precision was achieved with a front groove taper of 0.5 degrees, and the material used was HPM31 (HRC56-58). 【Project Overview】 - Product Name: Core Pin for Molding - Material: HPM31 (HRC56-58) - Size: 14×12×40mm - Processing/Treatment: Electrical Discharge Machining and Polishing - Industry: Semiconductor < WTM Supporting Solutions for Manufacturing Challenges > For more details, please view our company brochure by clicking "Download Catalog" below, or feel free to contact us.

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