Socket for Advanced Packages for Data Centers
Achieving high-density package measurement at a low cost. Balancing stable contact and cost efficiency.
In the data center industry, there is an increasing demand for high-performance and high-density semiconductor packages due to the rise of AI and big data processing. In the testing of these packages, multi-pin support and high-speed operation are essential. It is important to have measurement methods that ensure stable electrical connections while also achieving cost efficiency. Our "Advanced Package Socket" utilizes PCR technology to achieve short-distance connections and stable contact, providing cost advantages in multi-pin package testing. It also accommodates warping in large packages, alleviating concerns about insufficient stroke. 【Use Cases】 - Testing of high-density packages - Measurement of multi-pin packages - Testing of chips for AI and big data processing 【Benefits of Implementation】 - Ensuring stable electrical connections - Improving cost efficiency - Supporting high-speed operation testing
basic information
**Features** - Compatible Pitch: 1.27 to 0.25 mm - Compatible grid number: 100x100 (approx.) - Compatible size: 100x100 mm (electrode area/approx.) - Operating temperature range: Standard type/-40 to 125℃, Wide range type/-55 to 150℃ **Our Strengths** JMT Corporation provides pressure conductive sheets for semiconductor package inspection and jigs & pressure conductive sheets for printed circuit board inspection, based on PCR (rubber sheet) technology. We combine the technology cultivated over many years to offer high-performance test contactors.
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Applications/Examples of results
- Final selection test (handler) - System level test / SLT - High-frequency verification evaluation - Design verification evaluation - Reliability evaluation - Debug verification - Inter-board connection (short-distance connection connector, solder replacement) / BtoB - Burn-in test
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JMT Corporation is a company that handles PCR (rubber sheets), pressure conductive sheets for semiconductor package inspection, and jigs & pressure conductive sheets for printed circuit board inspection. We will provide high-performance test contactors by integrating our long-cultivated plating technology, photolithography technology, laser technology, and PCR technology. Please feel free to contact us if you have any inquiries.