Test socket
Test socket
About the test socket
1～30 item / All 30 items
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Test solution "PCR"
Test solution that does not damage solder balls or measurement substrates with soft contact!
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Semiconductor package test contactor PCR
This is a sheet-type contactor that achieves advanced measurements at low cost. It allows for stable connections without damaging the measurement object or the measurement board.
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IC test socket
IC testing is possible from fine pitch to large packages using a test socket with a sheet-type contactor that can be easily attached.
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Socket for advanced packages
We can offer affordable measurements of high-performance, multi-pin packages that integrate various chips.
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High-frequency measurement test socket
As communication generations progress with 5G, 5G-Advanced, and 6G, the PCR socket addresses the challenges of high-frequency measurements in the demand for increased speed.
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What is a test contactor sheet socket/PCR?
Supports various testing processes! Sheet socket "PCR" enables high-speed and high-density measurements.
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What is a pressurized conductive sheet that allows for stable electrical testing? *Technical materials available.
A sheet socket that enables stable inspection in semiconductor back-end process inspection! What is "PCR" that allows for high-speed and high-density measurements? Technical materials on operating principles and more will be provided!
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Characteristic verification socket
PCR sockets leverage the advantages of short-distance connections and can be applied in various applications that require detailed characteristic data verification.
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High-frequency IC measurement PCR sheet (distributed PCR)
Distributed PCR is a sheet-type semiconductor test contactor that can connect to all points in the plane without the need for positioning.
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IC measurement substrate damage protection tool
Protects the measurement board from damage to the pad of the probe pin socket. Enables the operation of expensive measurement boards without the need for maintenance.
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Short-distance connection connector
Leveraging the advantages of short-distance connections, we will replace the connections that only had implementation solutions with a socket-based approach.
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Socket for System Level Testing (SLT)
By leveraging the advantages of short-distance connections, it is possible to conduct characteristic verification in a state close to the implementation status.
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LID Less Socket
We can propose a socket structure that does not require LID for measurements such as image sensors that need optical testing.
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High-Frequency Measurement Test Socket for the Telecommunications Industry
High-frequency measurement sockets supporting signal quality in the 5G/6G era.
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Socket for SLT for semiconductors
Achieve characteristic verification close to the implementation state with short-distance connections.
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SLT socket for data centers
Contributing to the efficiency of data centers through characteristics verification close to the implementation state.
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Socket for System Level Testing (SLT) for Communication
Achieve characteristic verification close to the implementation state with short-distance connections.
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High-frequency measurement test socket for communication.
High-frequency measurement sockets supporting signal quality in the 5G/6G era.
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High-frequency measurement test socket for data centers
5G/6G compatible! PCR socket that solves high-frequency measurement challenges for servers.
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High-frequency measurement test socket for semiconductor packages
High-frequency measurement socket compatible with high-speed communication in the 5G/6G era.
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High-frequency measurement test socket for ADAS
High-frequency measurement socket compatible with 5G/ADAS high-speed communication.
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High-frequency measurement test socket for IoT wireless applications
Solving high-frequency measurement challenges for high-speed wireless communication in the 5G/6G era.
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IC Measurement Board Damage Protection Tool for IoT Devices
Protecting the measurement board of small IoT devices from pad damage.
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Automotive IC Measurement Board Damage Protection Tool
Protects the measurement board from damage to the pad of the probe pin socket, improving reliability.
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Socket for Advanced Packages for Data Centers
Achieving high-density package measurement at a low cost. Balancing stable contact and cost efficiency.
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Socket for Advanced Package for Automotive Use
For high-performance, multi-pin package measurement for miniaturized automotive electronic devices.
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Socket for Advanced Packages for Communication
Achieve low-cost measurement of multi-pin packages and contribute to bandwidth expansion.
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Socket for Advanced Package for AI
Affordable proposal for measuring high-performance, multi-pin packages.
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Socket for Advanced Package for IoT
We propose affordable measurement of high-performance, multi-pin packages that fuse various chips.
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LID Less Socket for Semiconductors
Optimal for optical testing, achieving high speed with a lidless structure.
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