3.5-inch Single Board Computer SBC [MIO-5391]
7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.
- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support
basic information
- Provides top performance in an ultra-small size - Equipped with Kaby Lake-H embedded CPUs - Xeon E3-1505M V6 (8M Cache, Base 3.0GHz, Max 4.00 GHz) - Core i7-7820EQ (8M Cache, Base 3.0GHz, Max 3.70 GHz) - Core i5-7442EQ (6M Cache, Base 2.1GHz, Max 2.90 GHz) - Core i3-7102E (3M Cache, 2.1GHz) - Features Intel Gen9 graphics capabilities and supports HEVC/H.265 and VP9 hardware transcoding - Can utilize a compact space of 14cm x 10cm - Operates on a single 12V power supply, making it possible to effectively use existing assets - By using the optional MIOe power module, it can support 12V to 24V or 9V to 36V - Available for supply for over 10 years since launch (please contact us for detailed supply schedule)
Price range
P3
Delivery Time
OTHER
Model number/Brand name
Advantech MIO Series
Applications/Examples of results
Single board computer, manufacturing industry, AI, IoT, edge computing, processing machine, lathe, image inspection device, surveillance camera system, medical devices.
Line up(4)
Model number | overview |
---|---|
MIO-5391E-4MH0A1 | Equipped with Intel Xeon Processor E3-1505M v6 |
MIO-5391-C7H0A1 | Equipped with Intel Core i7-7820EQ Processor |
MIO-5391-C5U1A1 | Intel Core i5-7442EQ Processor |
MIO-5391-C3U1A1 | Intel Core i3-7102E Processor |
catalog(1)
Download All CatalogsNews about this product(3)
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【Product Introduction Webinar on August 3 (Monday) from 13:30 to 14:00】Introduction of the Intel 8th Generation Ultra-Low Power Core i7 Compatible Single Board Computer MIO-5373.
Advantech will hold a webinar introducing selected embedded products from its approximately 3,000 product offerings. The webinar on August 3rd (Monday) will feature an embedded SBC equipped with the Whiskey Lake microarchitecture. We have announced the latest 3.5-inch SBC, MIO-5373, based on the 8th generation Intel Core platform with a low-power SoC. The compact MIO-5373, measuring 146 x 102mm, not only boasts excellent I/O capabilities but also includes domain-focused features such as CANBus and wide power input. It is ideal for applications in fields such as medical devices, automation control systems, outdoor kiosks, and areas that require Intel Core-level performance. Date: August 3rd (Monday) Time: 13:30 - 14:00 Title: Introduction to the Intel 8th Generation Ultra-Low Power Core i7 Compatible Single Board Computer MIO-5373 ○ Product Introduction Series Quick overview, new product introduction online seminar https://register.gotowebinar.com/rt/8465717673035304975
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[8/30 Nagoya] Advantech Design-In Forum 2018
This year's forum will feature key players in the IoT field, such as Microsoft Japan and Arm, as solution partners of Advantech, who will give presentations centered around the theme of edge x cloud. Additionally, the program will include a more luxurious lineup than in previous years, showcasing various solution-ready packages (SRP) utilizing Advantech's latest edge computing solutions across different verticals. Advantech Design-In Forum (ADF) 2018 Event Overview [Nagoya Venue] Date and Time: August 30, 2018 (Thursday) 13:15 - 19:00 (Registration and Exhibition: 12:00 -) Venue: Nagoya International Center 5F http://www.nic-nagoya.or.jp/japanese/nicnews/aramashi/nicaccess Capacity: 80 people Participation Fee: Free Contact: Advantech ADF Secretariat Phone: 0800-500-1055 (Toll-Free) Email: ajp_marcom@advantech.com
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[9/4 Osaka] Advantech Design-In Forum 2018
This year's forum will feature speakers from key players in the IoT field, such as Microsoft Japan and Arm, who will present on themes centered around edge x cloud. Additionally, the program will include a more luxurious lineup than in previous years, showcasing various solution-ready packages (SRP) utilizing Advantech's latest edge computing solutions across different verticals. Advantech Design-In Forum (ADF) 2018 Event Overview [Osaka Venue] Date and Time: September 4, 2018 (Tuesday) 13:15 - 18:00 (Registration and Exhibition: 12:00 -) Venue: Grand Front Osaka Knowledge Capital https://kc-space.jp/accessmap/conference/ Capacity: 100 people Participation Fee: Free Contact: Advantech ADF Secretariat Phone: 0800-500-1055 (Toll-Free) Email: ajp_marcom@advantech.com