Fischer Elektronik manufactured SMT heat sink
Fischer Elektronik manufactured SMT heat sink
Copper heat sinks for power semiconductors in surface mount packages such as D PAK (TO 252), D2 PAK (TO 263), D3 PAK (TO 268), SOT 669 LF PAK, SO IC-8 FL MP, Power SO-8, Power SO-10, Power SO-20, Power SO-36, SO-14, SO-16, SOT 223. They can be directly mounted (soldered) onto the substrate, and there are types available that allow for tape packaging selection.
1～14 item / All 14 items
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"FK-244-13-D2-PAK" SMT Heat Sink
For heat dissipation of surface-mounted power devices.
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"FK-244-08-D-PAK" SMT Heat Sink
SMT heatsink for DPAK (TO-252) package
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"FK-244-08-D2-PAK" SMT Heat Sink
SMT heatsink for D2PAK (TO 263) package
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"FK-244-08-D3-PAK" SMT Heat Sink
Heat sink compatible with D3PAK (TO 268 package) that can be soldered to the substrate.
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"FK-244-13-D-PAK" SMT Heat Sink
SMT heat sink that can be directly soldered to the substrate.
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"FK-244-13-D3-PAK" SMT Heat Sink
Copper heat sink that can be directly soldered to SMT boards, with a width of 31mm, height of 10mm, and length of 13mm.
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"FK-251-08-LF-PAK" SMT Heat Sink
Copper heat sink that can be directly soldered to SMT circuit boards, with a width of 15mm, height of 8mm, and length of 13mm.
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"FK-250-06-LF-PAK" SMT Heat Sink
Copper heat sink that can be directly soldered to SMT boards, with a width of 15mm, height of 6.5mm, and length of 8mm.
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"FK-250-08-LF-PAK" SMT Heat Sink
Copper heat sink that can be directly soldered to an SMT board, with a width of 15mm, height of 8mm, and length of 8mm.
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"FK-250-10-LF-PAK" SMT Heat Sink
Copper heat sink that can be directly soldered to an SMT board with dimensions of 15mm width, 10mm height, and 8mm length.
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"FK-251-06-LF-PAK" SMT Heat Sink
Copper heat sink that can be directly soldered to SMT boards, dimensions: width 15mm, height 6.5mm, length 13mm.
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"FK-251-10-LF-PAK" SMT Heat Sink
Copper heat sink that can be directly soldered to SMT boards, dimensions: width 15mm, height 10mm, length 13mm.
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SMT heat sink for DPAK package FK256
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
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SMT heat sink for DPAK package FK283
A new style heat sink with lower thermal resistance than the popular FK244 series.
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