Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA.
Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA.
Heat sink and fan from JRAO Thermal, USA.
31～60 item / All 66 items
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Water-cooled heat sink friction stir welding cooling plate
It ensures reliable and seamless bonding through solid-state FSW.
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Water-cooled heat sink embedded tube cooling plate
Maximizing the efficiency of the thermal system with an optimized aluminum base plate and embedded tubes.
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40x40x10mm car-mounted cooling fan
It is designed to adopt cutting-edge technology to reduce the vehicle's energy consumption while stabilizing the important systems inside the vehicle.
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Super Boost AC Fan
By connecting two AC fans of the same size in series, we achieve unparalleled boost effects, establishing a new standard for efficient air circulation, cooling, and ventilation.
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INTEL AMD Professional Grade CPU Cooler
Providing optimal cooling solutions from Intel's desktop Core i series to AMD's server-oriented EPYC processors.
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40x40x28mm IP68 DC axial fan
The IP68 DC axial fan is designed to withstand the harshest environments, providing unparalleled dust, water, and corrosion protection.
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30,000 RPM high-speed axial fan 40x40x28mm
High-performance fan that achieves both ultra-high speed and low noise, ideal for 5G and communication equipment cooling applications.
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Intel LGA4677 server-grade CPU cooler
Supports the latest Xeon processors, suitable for high-performance servers and data centers.
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BGA heat sink width 8.5mm length 8.5mm height 8mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink, width 10mm, length 10mm, height 10mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink, width 12mm, length 12mm, height 18mm.
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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Heat sink for substrate mounting H25 x W15 x Height 10.5mm
Aluminum extruded heat sink with pins for substrate fixation, featuring M3 screw holes for semiconductor mounting.
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Punch-out heat sink L22.7 x W25.0 x H10mm
Clip-type heat sink using AL1050 (with mounting pins for circuit board)
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BGA heat sink, width 14mm, length 14mm, height 6mm.
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 15.2 x 15.2mm height 6.4mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heat sink 17 x 17mm height 11.5mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 18 x 18mm height 10mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 20 x 20mm height 9mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heat sink 21 x 21mm height 8.9mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 23 x 23mm height 6mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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Heat sink for substrate mounting L50.8 W41.6 H25.0 mm
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
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Heat sink for substrate mounting L38.1 W41.6 H25.0 mm
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
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Heat sink for substrate mounting L25.4 W41.6 H25.0 mm
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
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Heat sink for substrate mounting L38.1 W34.9 H12.7 mm
Aluminum extruded heat sink with pins for fixing the substrate and nylon washers.
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Heat sink for substrate mounting L25.4 W34.9 H12.7 mm
Aluminum extruded heat sink with substrate fixing pins and nylon washers.
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Heat sink for substrate mounting L50.8 W34.9 H12.7 mm
Aluminum extruded heat sink with substrate fixing pins and nylon washers.
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DC frameless fan, 36.9mm diameter, thickness 10mm
The frameless design allows for direct integration into heat sinks and housings, minimizing space usage.
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Heat sink for substrate mounting L50.8 W41.6 H25mm
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
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BGA heatsink 23 x 23mm height 18mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 23 x 23mm height 25mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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