Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA.
Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA.
Heat sink and fan from JRAO Thermal, USA.
61～77 item / All 77 items
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BGA heatsink 27 x 27mm height 6mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 27 x 27mm height 18mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 35 x 35mm height 14mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
last updated
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BGA heatsink 35 x 35mm height 18mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
last updated
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BGA heatsink 40 x 40mm height 23mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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BGA heatsink 30.7 x 30.7mm height 14.1mm
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
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Heat sink for IGBT modules (cold forged heat sink)
An IGBT heat sink that efficiently suppresses the temperature rise of high heat density IGBTs and can be optimized according to application and design conditions.
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Heat sink for IGBT modules for EVs
Heat sink for IGBT modules contributing to the high efficiency of EVs.
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Heat sink for IGBT modules for industrial robots
High-efficiency heat sinks that support the acceleration of industrial robots.
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Heat sink for IGBT modules for medical devices
A high-efficiency heat sink that contributes to the miniaturization of medical devices.
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Heat sink for IGBT modules for data centers
High-efficiency IGBT heat sink to solve heat issues in data centers.
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Heat sink for IGBT modules for UPS
High-efficiency heat sink supporting stable operation of UPS.
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Heat sink for IGBT modules for industrial machinery
Contributes to the suppression of temperature rise in high thermal density IGBTs that support precision control.
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Heat sink for IGBT modules for welding machines
Ideal for high-power welding machines! A heat sink that suppresses the temperature rise of IGBTs.
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JtraLED-130 Series Star Heat Sink
It is designed to allow the main manufacturer's LED modules and COB to be fixed with screws.
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Ultra-thin IC cooler | Compatible with 1U, FPGA, and CPU
Ultra-thin IC cooler (fan-equipped heat sink) that meets thermal management needs for high-density packaging.
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Cold Forged Pin Fin Heat Sink | High Heat Dissipation and High-Density Mounting Compatible
High thermal conductivity pin fin heat sink addressing thermal challenges of high-density packaging.
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