Data Center Heat Management: IC Coolers for Low-Profile Equipment
Slim design with a height of 11.6mm. Parallel arrangement of the fan and heat sink accommodates IC cooling in limited spaces.
In data centers, efficient thermal management in limited space is required due to the high density of servers and network equipment. The JARO Thermal "JSC00120" is a slim IC cooler with fans and heat sinks arranged in a parallel configuration. With a low-profile design of L90.0 × W45.0 × H11.6mm, it is suitable for equipment with height constraints on cooling components. 【Features】 - Slim design with a height of 11.6mm - Parallel arrangement of fans and heat sinks - Cooling structure that directs airflow horizontally - Low power consumption and low thermal resistance - RoHS compliant It can be used for IC cooling in servers, network equipment, graphics cards, GPUs, FPGAs, and more. For detailed information on the structure and fluid analysis results of the JSC00120, click here.
basic information
【Features】 - Slim and space-saving design with a height of 11.6mm - Lateral cooling structure with parallel arrangement of fan and heat sink - Low power consumption and low thermal resistance - Low noise to CFM ratio - RoHS compliant
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Delivery Time
Model number/Brand name
JSC00120・JARO Thermal
Applications/Examples of results
- Cooling of CPU, GPU, FPGA, and ASIC - Cooling of processors and controllers - Network devices and network cards - Graphics cards and video cards - Industrial computers - Embedded devices - Thin and compact electronic devices - Thermal management for high-density printed circuit boards
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