DLP Projector OPR405 Series
Industrial DLP projectors that achieve high-precision 3D inspection.
This is an industrial DLP projector suitable for solutions requiring high-speed and high-precision 3D inspection, targeting applications such as 3D measurement, appearance inspection, and medical image processing. The OPR405 series with RGB light source is ideal for solutions that require high-speed and high-precision 3D inspection, and it also supports wide-ranging and high-precision projection as well as high-speed inspection. Its sophisticated optical and structural design minimizes thermal deformation, ensuring high-quality projection effects.
basic information
Equipped with DMD: TI DLP4500 0.45-inch WXGA DLP Digital Micromirror Device (DMD) For more details, please refer to the PDF document or feel free to contact us. We also offer rental of demo units.
Price range
Delivery Time
Applications/Examples of results
3D measurement, 3D scanning, parts/circuit board appearance inspection, medical image processing, and other industrial image processing focused on semiconductors and electronics.
Line up(2)
| Model number | overview |
|---|---|
| OPR405200 | Operating distance (TYP): 2000 / Projection area (mm): 1667×1042 / Projection accuracy (µm): 914 / Projection mode: Orthographic / Light source: RGB (300lm) |
| OPR405200X | Operating distance (TYP): 2000 / Projection area (mm): 1667×1042 / Projection accuracy (µm): 914 / Projection mode: Offset 100% / Light source: RGB (450lm) |
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Notice of Participation in Nepcon Japan 2026 | January 21 (Wed) - 23 (Fri) Tokyo Big Sight
We will be exhibiting at "Nepcon Japan 2026," which will be held at Tokyo Big Sight from January 21 (Wednesday) to 23 (Friday), 2026. We will focus on showcasing the following products, so please be sure to visit our booth. - 105MP/245MP ultra-high-resolution sensor CoaXPress area scan cameras - 10MP/14MP/21MP ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras - DLP projectors, 3D-Camera series ◇◆Nepcon Japan 2026 □ Dates: January 21 (Wednesday) to 23 (Friday), 2026, 10:00 AM to 5:00 PM □ Venue: Tokyo Big Sight, East Exhibition Hall, E10-37 For details and visitor registration, please visit ➤ https://www.nepconjapan.jp/tokyo/ja-jp.html#/ Please take this opportunity to see our industrial cameras, designed and developed in Japan, which combine performance, quality, cost, and delivery time at a high level, focusing on CoaXPress cameras!
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Notice of Participation in the International Image Device Exhibition | December 3 (Wed) - 5 (Fri) at Pacifico Yokohama
We will be exhibiting at the "International Image Device Exhibition 2025" held at Pacifico Yokohama from December 3 (Wednesday) to December 5 (Friday), 2025. We will be showcasing the following products, so please stop by our booth. - 105MP/245MP ultra-high-resolution sensor CoaXPress area scan cameras - 10MP/14MP/21MP ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras - DLP projectors, 3D-Camera series ■ Event Dates December 3 (Wednesday) to December 5 (Friday), 2025 / 10:00 AM to 5:00 PM ■ Venue / Booth Number Pacifico Yokohama Exhibition Hall D / "8" ■ Exhibition Website URL https://www.adcom-media.co.jp/ite/ Please take this opportunity to see our industrial cameras, designed and developed in Japan, which combine high performance, quality, cost, and delivery time!
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We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.




































