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Next-generation laminate "Clear Sheet" for printed circuit boards, featuring independent bubbles for insulation and cushioning.

It absorbs shock energy and has a cushioning effect due to independent bubbles. It also excels in elasticity, resilience, and durability! The anti-static agent prevents static electricity and foreign substances.

The next-generation composite material for printed circuit boards, "Clear Sheet," has low thermal conductivity due to independent bubbles and low moisture absorption, providing insulation effects. It has moderate flexibility and excellent elasticity. It also boasts superior resilience, maintaining cushioning properties close to the initial state even after repeated impacts. Since it uses polyethylene, it does not generate dioxins. Its foamed structure is designed with consideration for the environment, energy conservation, and resource savings. 【Features】 ○ Protects products with excellent cushioning properties ○ No self-dusting due to being made of plastic material ○ Anti-static agents prevent issues caused by static electricity and the adhesion of foreign substances For more details, please contact us or download the catalog.

Related Link - http://www.cerma.co.jp/index.html

basic information

【Features】 ○ Does not adversely affect the target metal compared to other interleaving papers ○ Lighter than other sheets, making it excellent for handling ○ Superior electrical properties such as damping rate compared to other interleaving papers ○ Excellent flexibility and resilience, allowing for long-term use ○ Processed in a clean room, ensuring no foreign matter contamination ○ Can be processed into various thicknesses and sizes ● For more details, please contact us or download the catalog.

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Next-generation laminate for printed circuit boards "Clear Sheet"

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