Dissimilar material AuSn solder joint for semiconductor packaging
Strongly bonding dissimilar materials such as glass, metal, ceramics, and silicon.
In the semiconductor packaging industry, the bonding technology of dissimilar materials has become important due to the miniaturization and high performance of products. In particular, reliable sealing is essential for the long-term performance maintenance of products. Conventional resin-based adhesives have faced challenges in chemical resistance and long-term reliability, but our AuSn solder sealing technology demonstrates excellent chemical resistance and stable sealing performance even in high vacuum environments, making it suitable for harsh usage conditions. The AuSn solder method using heat treatment allows for seamless sealing through uniform melting, achieving stable sealing joints. 【Application Scenarios】 - Sealing of semiconductor packages - Use in high vacuum environments - Environments requiring chemical resistance 【Benefits of Implementation】 - Ensuring high reliability - Extension of product lifespan - Contribution to miniaturization and high performance
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【Features】 - Strong chemical and water resistance (e.g., sodium hypochlorite) - Capable of handling low to high vacuum ranges - Possible to join dissimilar materials (glass, metal, ceramics, silicon) 【Our Strengths】 Citizen Fine Devices leverages the technology cultivated over many years in the field of functional components that require small size, precision, and high detail to provide high value-added microdevice products. Based on the metal processing technology developed in watch manufacturing, we have established a consistent production system from process design to processing, assembly, and functional testing. We also possess mass production technology for brittle materials, producing high-quality functional device products such as high-precision components made from ceramics and quartz, as well as liquid crystal devices and sensing devices.
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Glass-metal, ceramics-metal, ceramics-silicon, ceramics-glass, we do not limit applications. Please feel free to contact us.
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The area where Citizen Fine Devices demonstrates its strength is in the realm of functional components that require small size, precision, high accuracy, and high detail. We believe that our mission is to continue providing high-value-added microdevice products by leveraging the unique technologies we have developed over many years. Utilizing metal processing technology rooted in watch manufacturing, we have consistently supplied small, high-precision components to our customers for many years through a fully integrated production line that encompasses process design, machining, assembly, and functional testing, along with the unique development of our own processing machines. Additionally, mass-producing components with high precision and efficiency using brittle materials is also one of our core technologies. By integrating material technology with ultra-precision machining, thin-film technology, and bonding technology, we produce not only high-precision components such as ceramics and quartz but also high-quality functional device products like liquid crystal devices and sensing devices. Continuing to provide high-value-added products to the market is a significant dream for our employees. We will contribute to the creation of new value through manufacturing driven by the challenge spirit of each individual, working towards the realization of that dream.