Compact CXP camera series capable of high frame rates and long-distance transmission.
This is a compact camera with high resolution of 5.3M/2M that enables high frame rates and long-distance transmission by using CoaxPress for the interface.
★ High resolution, compact, and lightweight size - CMOS sensor, size W29×H29×D55mm, approximately 66g (VCC-5CXP3, VCC-2CXP6) - CMOS sensor, size W29×H29×D29mm, approximately 50g (VCC-2CXP2) ★ CoaxPress interface Video output via BNC connector. Long-distance transmission is possible. Maximum cable length of 100m. ★ Achieving high resolution and high frame rate With CoaxPress output, the fastest is 5.3 million pixels/85fps (CXP5, CXP6), 2.5 million pixels/85fps (2.5 million pixels), 2.03 million pixels/239fps (CXP6, 8bit) ★ Equipped with functions necessary for FA applications Global trigger shutter operation is possible, ROI function allows selection of target image area, defective pixel correction, PoCXP, etc. Available in monochrome (M), color (R), and NIR (near-infrared) specifications * The NIR model is only available for VCC-5CXP3NIR. * VCC-2CXP2 is available only in monochrome type.
basic information
◆SPEC Model Name: VCC-5CXP3M (Monochrome), VCC-5CXP3R (Color), VCC-5CXP3NIR (Near Infrared Model) Sensor: 1-inch CMOS 4.8×4.8μm Effective Pixel Count: 2592×2048 Frame Rate: Max. 85fps (CXP5・6) Shutter: OFF～1/10,000s Dimensions: W29 x H29 x D55 mm Model Name: VCC-2CXP6M (Monochrome), VCC-2CXP6R (Color) Sensor: 1/1.7-inch CMOS 4.5×4.5μm Effective Pixel Count: 1632×1248 Frame Rate: Max. 239fps (CXP6・8bit) Shutter: OFF～1/66,000s Dimensions: W29 x H29 x D55 mm Model Name: VCC-2CXP2M (Monochrome) Sensor: 2/3-inch CMOS 4.8×4.8μm Effective Pixel Count: 1984×1264 Frame Rate: 85fps (CXP3・2), 42fps (CXP1) Shutter: OFF～1/5,000s Dimensions: W29 x H29 x D29 mm
Price range
Delivery Time
Model number/Brand name
VCC-5CXP3/VCC-2CXP6/VCC-2CXP2
Applications/Examples of results
Medical image processing devices that prioritize image quality and speed, SPI, AOI, substrate inspection devices, PTP inspection, food and pharmaceutical inspection, dimensional inspection, foreign matter and appearance inspection, FPD inspection, micro-component inspection, wafer inspection, semiconductor manufacturing process inspection, robot vision, welding inspection, AR/VR, drone-mounted, measurement and analysis, security, etc.
Detailed information
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