Maximize inspection efficiency! For those who want to achieve wide, detailed, and fast results.
A wide range of industrial cameras that are suitable for various needs such as labor-saving, reducing personnel, and increasing productivity, all capable of high resolution and high-speed capture!
With the diversification of product needs in the market, there is a demand for inspection equipment and devices to diversify specifications, improve productivity, and shorten delivery times, in order to achieve labor-saving, reduce manpower, enhance productivity, and increase quality value by reducing human errors. In addition to ensuring the accuracy of inspections, the miniaturization of IC products in recent years has led to higher resolution images being used for inspections, making the improvement of inspection speed and accuracy one of the challenges. CIS Corporation offers a wide range of industrial cameras that can meet diverse needs, supporting high resolution and high-speed capture. We can propose the most suitable products for various applications, including inspections in semiconductor manufacturing processes such as wafer, wire bonding, and packaging, as well as electronic circuit board appearance inspection (AOI), solder paste inspection (SPI), panel inspection, LED inspection, and electronic device inspection.
basic information
**Product Summary** ■VCC-25CXP1M Interface: CXP6×4lanes Sensor: APS-H type CMOS 4.5μm×4.5μm Effective Pixel Count: 5120 x 5120 Frame Rate: 82fps (CXP6・8bit×4lanes), 65fps (CXP6・10bit×4lanes) Lens Mount: M48 mount Dimensions/Weight: 65(W)×65(H)×65(D)mm ■VCC-50CXP1M *Under Development* Interface: CXP12・CXP6 Sensor: 35mm type CMOS 4.6μm×4.6μm Effective Pixel Count: 7920 x 6004 Frame Rate: 30.5fps (CXP12×2lanes, CXP6×4lanes) Lens Mount: M58 mount Dimensions/Weight: 65(W)×65(H)×93.3(D)mm
Price range
Delivery Time
Model number/Brand name
CIS CoaXPress Camera Series / Camera Link Camera Series
Applications/Examples of results
Inspection at various stages of semiconductor manufacturing such as wafer, wire bonding, and packaging, as well as electronic substrate appearance inspection (AOI), solder paste inspection (SPI), panel inspection, LED inspection, and electronic device inspection.
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