[Application Examples] Advanced Packaging / Interconnect
Ensure high availability with minimal component costs! Maximize throughput and yield.
We offer advanced packaging/optical interconnect lasers that maximize throughput and yield while ensuring high availability at minimal component costs. By achieving maximum laser control, debris is reduced, and post-processing cleaning is minimized. We can process any materials or combinations, including organic materials, metals, and ceramics. 【Product Lineup by Purpose (Partial)】 ■ PCB Drilling - AVIA LX - AVIA NX - HYPERRAPID NXT - RAPID LX *For more details, please refer to the PDF document or feel free to contact us.
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【Other Purpose-Specific Lineup (Excerpt)】 ■ Ceramic Processing - DIAMOND C/CX Series / PCB Depaneling - AVIA LX - HYPERRAPID NXT - RAPID LX ■ Laser Marking - POWERLINE ■ Optical Stripping - AVIA LX - AVIA NX - INDYSTAR *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.