Revolutionizing Semiconductor Packaging! Connectec Japan's Challenge
Revitalizing Japan's manufacturing industry with the power to change and the power to connect.
We would like to introduce our philosophy of connecting companies, technology, and people to pave the way for the future of IoT implementation. Based in the semiconductor "back-end" hub that spans from the Joetsu region of Niigata Prefecture to Nagano Prefecture, we aim to create the world's first and best technologies. With our low-temperature packaging technology "MONSTER PAC" and fine wiring technology "FSNIP" as our weapons, we respond to various packaging needs. Together with like-minded colleagues, our mission is to contribute to society through job creation. *For more details on Connectec Japan's corporate philosophy and business overview, you can download it here.
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You can download the details of Connectec Japan's corporate philosophy and business overview from here.
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You can download the details of Connectec Japan's corporate philosophy and business overview from here.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.