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Connect Tech Japan creates the future with MONSTER PAC.
Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.
![[Example of Problem Solving] Equipment Manufacturer](https://image.mono.ipros.com/public/product/image/b27/2000676169/IPROS86753049089194604765.png?w=280&h=280)
![[Example of Problem Solving] Material Manufacturer](https://image.mono.ipros.com/public/product/image/85d/2000676167/IPROS58441481540842475156.png?w=280&h=280)
![[Example of Problem Solving] Chip Manufacturer](https://image.mono.ipros.com/public/product/image/891/2000676165/IPROS52931881156508345367.png?w=280&h=280)
![[Example of Problem Solving] System and Set Manufacturers](https://image.mono.ipros.com/public/product/image/2d5/2000676135/IPROS51749341464959088947.png?w=280&h=280)

