Product Categories
Products/Services（16items）
-
Breaking through the challenges of the semiconductor industry! The CADN amoeba consortium starting with small-scale prototypes.
-
Example 4: Advanced technology for millimeter-wave compatible three-layer RDL substrates and chip bonding.
-
![[Case 3] Shortest connection implementation solution for SOC + memory module](https://image.mono.ipros.com/public/product/image/2050376/IPROS14107081318171957006.jpg?w=280&h=280)
[Case 3] Shortest connection implementation solution for SOC + memory module
-
![[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors](https://image.mono.ipros.com/public/product/image/2050376/IPROS16842990981086862973.jpg?w=280&h=280)
[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors
-
![[Case 1] Realization of high sensitivity using 3D implemented chiplet X-ray sensors.](https://image.mono.ipros.com/public/product/image/2050376/IPROS13874683072329868725.jpg?w=280&h=280)
[Case 1] Realization of high sensitivity using 3D implemented chiplet X-ray sensors.
-
"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.
Aboutコネクテックジャパン
Connect Tech Japan creates the future with MONSTER PAC.
Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.