"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.
Low-temperature bonding from 80℃ unlocks the potential of heat-sensitive devices.
We have achieved high-precision mounting on thermally fragile chips and film substrates, which was impossible with conventional solder mounting. Standard solder joints require high temperatures of 260°C, but MONSTER PAC enables low-temperature bonding at 80°C to 170°C using conductive paste. This suppresses thermal expansion of materials and allows for narrow pitches of less than 40μm and high-precision mounting of less than 3μm. It is a suitable method for mounting advanced devices sensitive to heat, such as magnetic sensors and MEMS. *You can download the technical details and specifications of MONSTER PAC from here.*
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You can download the technical details and specifications of MONSTER PAC from here.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.