Breaking through the challenges of the semiconductor industry! The CADN amoeba consortium starting with small-scale prototypes.
Backed by the collaboration of 300 domestic companies, we can achieve 'prototyping from a few pieces,' which is impossible for major OSATs.
In the early stages of development, a necessary "few to several dozen" prototypes. It is difficult for large companies to respond to this need, which is where our value lies. In large-scale companies like major foundries and OSATs that require significant investment recovery, mismatches in supply and demand for small-scale development projects tend to occur. "CADN" has established a decentralized production division model with small investments by organically connecting domestic legacy lines and research institutions. While hedging against regional risks such as earthquakes and floods, we have set up a system that can flexibly respond to a wide variety of structural and construction method requests. *For more details on the new business model "CADN," which consolidates Japan's manufacturing capabilities, please download here.
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Details of the new business model "CADN," which consolidates Japan's manufacturing capabilities, can be downloaded here.
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Details of the new business model "CADN," which consolidates Japan's manufacturing power, can be downloaded from here.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.