[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors
Maximizing the opening rate with 1 million corner hole formations. Challenging the limits of semiconductor wafer processing.
The realization of high-sensitivity sensors requires extremely precise wafer processing technology to expand the light-receiving area. We conducted a special processing to form 1 million square holes with a 100µm pitch on a Φ200mm photodiode wafer. By maintaining square holes of 90µm and a thin wall structure of 10µm, we achieved an overwhelming large aperture ratio and successfully enhanced sensitivity. This is a fine processing solution unique to Connectec Japan, utilizing deep dry etching (DRIE) on silicon wafers. *The accuracy of wafer processing and detailed specifications are available in the downloadable materials.
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The precision of wafer processing and detailed specifications are available in the downloadable materials.
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The accuracy of wafer processing and detailed specifications are available in the downloadable materials.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.