[Case 1] Realization of high sensitivity using 3D implemented chiplet X-ray sensors.
Successfully achieved 3D stacking of heat-sensitive sensors and semiconductor LSIs at low temperatures with ultra-high-density implementation at 50µm intervals.
How to integrate heat-sensitive image sensors with high-speed processing LSI. We solved this challenge with our unique 3D stacking technology. By 3D stacking heat-sensitive X-ray image sensors and TSV-forming LSI at low temperatures, we achieved direct bonding of the sensor pixel signal terminals. By arranging 144 sensors, each measuring 10mm on a side, with a minimal gap of 50µm, we enable large-area and high-sensitivity sensing. This is a case that condenses our know-how in utilizing silicon interposers to maximize high-speed measurement processing. *For specific processes of advanced 3D stacking technology, please refer to the materials.
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You can find the specific processes of advanced 3D layering technology in the materials.
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You can find details about the specific processes of advanced 3D layering technology in the materials.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.