A new standard for outsourcing semiconductor packaging development called "OSRDA."
Flexible contract development that solves customers' "troubles."
We provide total support for special projects that are impossible on existing mass production lines, from the conceptual stage to mass production. OSRDA (Outsourced Semiconductor R&D Assembly) is a business model that distinguishes itself from mere assembly specialists (OSAT). We can handle any process related to implementation, from substrate design, process development, and prototyping to reliability testing, at any stage and from any point. We offer flexible solutions tailored to our customers' preferences, such as multi-variety variable production and the development of special applications. *Please take a look at the materials that explain the specific service flow of OSRDA.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.