[Data] BGA Mounting Board Data Specifications
Below t1.6! Here are examples of data specifications for BGA-mounted substrates.
This document presents examples of board data specifications for BGA mounted boards with a pitch of 1.6 mm or less. It introduces various specifications, starting with "4-pitch BGA mounted through resin-filled boards," "0.5-pitch BGA mounted through resin-filled boards," and the main specifications of build-up boards. We encourage you to read it. [Contents] ■ Through boards (Recommended design specifications for BGA section) ■ Build-up boards (Recommended design specifications for BGA section) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Publication Content Overview (Excerpt)】 ■ Through Hole Substrate (Recommended Design Specifications for BGA Section) - 0.4mm pitch BGA mounted through resin-filled substrate - 0.5mm pitch BGA mounted through resin-filled substrate - 0.65mm pitch BGA mounted through resin-filled substrate ■ Build-Up Substrate (Recommended Design Specifications for BGA Section) - Main specifications of our build-up substrate - 0.4mm pitch BGA mounted - 0.5mm pitch BGA mounted (Recommended design specifications for 0.5mm pitch section) *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
