Metal mask

Metal mask
This is an introduction to the metal mask-related products and processing services we offer.
1~13 item / All 13 items
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Metal mask special processing: super fine treatment
We are performing super fine processing to smooth the uneven surfaces of the opening walls of laser-processed metal masks.
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Metal mask special processing: half-etching treatment
You can freely adjust it by performing step cutting on the ski surface at any desired depth!
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Metal mask special processing: titanium coating treatment
Compared to standard metal masks and metal masks with fluorine coating, the printability has improved significantly!
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Space-saving one-touch frame
No need for tools or jigs! Storage space is reduced to one-third, and it can be securely fixed to the main frame with one touch.
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Flow carrier for post-reflow attachment
Reduce stress on components! Protects reflowed PCBs during soldering with excellent thermal insulation properties.
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Introduction to metal mask special processing and related implementation products.
We have listed the special processing for metal masks and the related assembly products that we offer!
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Characteristics of Daishin Sangyo Co., Ltd.
Even one unit is fine! We can accommodate from small lots to mass production.
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[Information] Daishin Sangyo Co., Ltd. Manufacturing Supplement
Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!
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[Data] BGA Mounting Board Data Specifications
Below t1.6! Here are examples of data specifications for BGA-mounted substrates.
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Printed circuit board "10-layer 3-4-3 build-up board"
Introducing a printed circuit board with a core section of 4-layer TH, resin-filled and lid-plated! It features a 0.4 pitch 256-pin BGA.
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Printed Circuit Board "6-Layer 2-2-2 Build-Up Board"
Introduction of a printed circuit board with a 0.3 pitch 144 pin BGA featuring via-on-via with copper plating!
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Printed circuit board "8-layer 6-stage continuous IVH board"
Introduction of a printed circuit board with a hole wall pattern gap of 0.175 and a 0.4 pitch 196 pin BGA.
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Register laser exposure
Introducing the use of resist ink PSR-4000 AM02SP! Exposure with the resist laser (DI: Direct Imager).
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