We will be exhibiting at "SEMICON JAPAN 2019."

日本エンギス
Nihon Engis will be exhibiting at "SEMICON JAPAN 2019," which will be held from December 11 (Wednesday) to December 13 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping device, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries about polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.


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Date and time Wednesday, Dec 11, 2019 ~ Friday, Dec 13, 2019
10:00 AM ~ 05:00 PM
- Capital Location: Tokyo Big Sight Exhibition: West Hall 1, Booth Number 2244
- Entry fee Free