Product Categories
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Diamond slurry
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Ultra-Precision Single-Surface Wrapping Device [Comprehensive]
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Comprehensive Catalog
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Wrapping plate
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Wrapping accessories
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Ultra-Precision Single-Surface Wrapping Device "EJW Series"
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Tabletop Unilateral Wrapping Device [For Research Purposes / Small Scale]
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Double-sided wrapping device
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Precision grinding machine
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Mold wrap products [hand-polished, hand tools]
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Polishing slurry
Featured products
Products/Services(62items)
news list
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We will be exhibiting at "SEMICON JAPAN 2024."
Nippon Engis will exhibit at SEMICON JAPAN 2024, held at Tokyo Big Sight. In addition to the vertical grinding machine "HVG-300ADM," we will showcase our polishing and grinding products. We look forward to your visit. Exhibition name: SEMICON JAPAN 2024 (Venue: Tokyo Big Sight) Booth number: 3714 Event dates: December 11 (Wednesday) to December 13 (Friday)
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Announcement of Website Renewal [Nihon Engis]
We have completely renewed the homepage of Japan Engis Co., Ltd.! In pursuit of a more user-friendly website, we have reviewed the design and page structure. Additionally, we have made it compatible with smartphone displays, making it easier to view on any device. Please take a look through the related links below. We will continue to strive to provide our customers with even more valuable information. Thank you for your continued support.
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We will be exhibiting at "SEMICON JAPAN 2019."
Nihon Engis will be exhibiting at "SEMICON JAPAN 2019," which will be held from December 11 (Wednesday) to December 13 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping device, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries about polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.
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We will be exhibiting at the International Conference on Silicon Carbide and Related Materials (ICSCRM 2019). (Event dates: September 30 to October 4, 2019)
Nihon Engis will exhibit at the "International Conference on Silicon Carbide and Related Materials 'ICSCRM 2019'" held from September 30 (Monday) to October 4 (Friday), 2019, at the National Kyoto International Conference Center. 《Exhibition Overview》 Date: 2019/9/30 (Monday) - 10/4 (Friday) Location: National Kyoto International Conference Center Exhibition Booth Number: C35 Official Website: https://www.icscrm2019.org/ We sincerely look forward to welcoming many of you to our booth.
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We will exhibit at the trade show "SEMICON JAPAN 2017" (Event dates: December 13, 2017 - December 15, 2017).
Nihon Engis will be exhibiting at "SEMICON JAPAN 2017," which will be held from December 13 (Wednesday) to December 15 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping machine, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries regarding polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.

About日本エンギス
Seeking High-Precision Wrapping Processes
Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.