Vertical Grinding Machine "HVG-300ADM"
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This is a grinding machine for hard and brittle materials equipped with a high-rigidity, high-precision spindle.
Engis Corporation's vertical grinding machine is a grinding system designed for hard and brittle materials, equipped with a high-rigidity and high-precision spindle (Engis HVG model). It achieves low-cost and high-precision wafer processing through semi-automatic control. Optional features include an auto-dressing mechanism for the grinding wheel, various thickness sensors for endpoint control of wafer thickness, and in-process thickness measurement technology. This equipment will be exhibited at SEMICON JAPAN 2024, held at Tokyo Big Sight from December 10 (Wednesday) to December 13 (Friday). We sincerely look forward to your visit. *Please feel free to contact us if you have any requests.
basic information
Exhibition Name: SEMICON JAPAN 2024 Venue: Tokyo Big Sight Dates: December 11 (Wednesday) - December 13 (Friday), 2024 Opening Hours: 10:00 AM - 5:00 PM Booth Number: 3714 ★ For more details, please request the materials.
Price information
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Price range
P7
Delivery Time
OTHER
Applications/Examples of results
Compound semiconductors such as SiC and GaN used in power devices, mechanical parts.
