Precision grinding machine

Precision grinding machine
Conventional grinding machines operated with the grinding wheel axis and the workpiece axis rotating in opposite directions for grinding, but the EHG-150 type is a horizontal grinding machine that, in addition to this operation, incorporates a new feature that oscillates the grinding wheel axis side to side to improve processing efficiency and flatness.
1~8 item / All 8 items
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Horizontal Grinding Machine "EHG Series"
It is possible to achieve processing efficiency and high precision flatness.
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Vertical Grinding Machine "HVG Series"
It is optimized for small lot production and research and development institutions.
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Grinding processing examples of SiC
Achieving double-sided grinding of SiC! Double-sided grinding processing.
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Grinding processing examples of sintered diamonds
Achieving high-speed high-pressure grinding of PCD! High-speed high-pressure grinding processing.
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2-axis vertical grinding machine 'HVG-200-2Axis'
Perform rough and precision grinding on a single work table. Suitable for small to medium lot production and research and development.
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Wafer Bonding Machine: EBM-250HC
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
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Wafer Bonding Machine: EBM-250HSC
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
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2-axis vertical grinding machine 'HVG-300DSO'
Rough grinding and precision grinding performed on a single work table. Suitable for small to medium lot production and research and development.
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