Vertical Grinding Machine "HVG Series"
It is optimized for small lot production and research and development institutions.
The compact vertical grinding machine from the "Trinity-Y" series has been born. It is particularly suitable for grinding hard and brittle materials, making it ideal for small lot production and research and development institutions. Furthermore, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. Additionally, combining it with other Trinity-Y models enables space-saving and the creation of an efficient, high-performance processing system. 【Specifications】 [HVG-200/HVG-250] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ200mm / φ250mm For more details, please contact us or download the catalog.
basic information
【Specifications】 [HVG-200/HVG-250] ○Rotational Speed: Maximum 20,000 rpm / Maximum 2,000 rpm ○Work Table Dimensions: φ200mm / φ250mm ○Rotational Speed: Maximum 400 rpm / Maximum 450 rpm ○Control: PLC / PLC ○Operation Panel: LCD Soft Touch Panel 7.4 inch / LCD Soft Touch Panel 12.1 inch ○Device Size (W×D×H): 800mm×800mm×1900mm / 1000mm×1100mm×1800mm ○Device Weight: 1,100 kgf / 2000 kgf ●For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
Power device wafer processing, MEMS, LED backlighting, semiconductor wafers, etc. ● For more details, please contact us or download the catalog.
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We will be exhibiting at the International Conference on Silicon Carbide and Related Materials (ICSCRM 2019). (Event dates: September 30 to October 4, 2019)
Nihon Engis will exhibit at the "International Conference on Silicon Carbide and Related Materials 'ICSCRM 2019'" held from September 30 (Monday) to October 4 (Friday), 2019, at the National Kyoto International Conference Center. 《Exhibition Overview》 Date: 2019/9/30 (Monday) - 10/4 (Friday) Location: National Kyoto International Conference Center Exhibition Booth Number: C35 Official Website: https://www.icscrm2019.org/ We sincerely look forward to welcoming many of you to our booth.
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We will exhibit at the trade show "SEMICON JAPAN 2017" (Event dates: December 13, 2017 - December 15, 2017).
Nihon Engis will be exhibiting at "SEMICON JAPAN 2017," which will be held from December 13 (Wednesday) to December 15 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping machine, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries regarding polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.