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Double-sided wrapping device
Double-sided wrapping device
The upper and lower plates rotate in opposite directions, and the carrier sandwiched between them orbits in the same direction as the lower plate while engaging with the sun gear at the center of the plate and the internal gear positioned around it. With extremely low friction, maintenance costs can be significantly reduced.
1～5 item / All 5 items
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High-precision double-sided lapping machine
Introducing the space-saving and high-precision double-sided wrapping machine!
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Grinding processing examples of SiC
Achieving double-sided grinding of SiC! Double-sided grinding processing.
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Grinding processing examples of sintered diamonds
Achieving high-speed high-pressure grinding of PCD! High-speed high-pressure grinding processing.
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Wafer Bonding Machine: EBM-250HC
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
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Wafer Bonding Machine: EBM-250HSC
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
last updated