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Wafer Bonding Machine: EBM-250HC

EBM-250HC.png

Wafer Bonding Machine: EBM-250HC

EBM-250HC.png
EBM-250HC.png

This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).

The EBM-250HC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in the thickness, flatness, warpage, and parallelism of the wafers.

Related Link - http://www.engis.co.jp/

basic information

【Device Specifications】 ■Compatible Wafer Size: Max. Φ248mm ■Heating Method: Electric Heating (Max. 150℃) ■Cooling Method: Chiller (Timer Control) ■Dimensions: W710 x D510 x H750mm *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

For more details, please refer to the PDF document or feel free to contact us.

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