Horizontal Grinding Machine "EHG Series"
![Ultra-Precision Single-Surface Wrapping Device [Comprehensive]](https://image.mono.ipros.com/public/premium/image_category/dc2/28947/IPROS2413482791955060326.jpg?w=140&h=140){kind=small}
![Tabletop Unilateral Wrapping Device [For Research Purposes / Small Scale]](https://image.mono.ipros.com/public/premium/image_category/dc2/28947/IPROS4741748957869880263.JPG?w=140&h=140){kind=small}
![Mold wrap products [hand-polished, hand tools]](https://image.mono.ipros.com/public/premium/image_category/dc2/28947/IPROS6747572529548368978.JPG?w=140&h=140){kind=small}
It is possible to achieve processing efficiency and high precision flatness.
The horizontal grinding machine "EHG-170AV" performs grinding operations while the grinding wheel axis and work axis rotate in opposite directions. The grinding wheel axis also oscillates left and right, enabling high processing efficiency and high precision flatness. By selecting the appropriate grinding wheel, it demonstrates effective power on almost all workpieces, including ceramics, and a wide range of difficult-to-machine materials. 【Specifications】 [EHG-170AV/EHG-250NC] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ180mm / φ250mm ○ Rotational speed: maximum 2,500rpm / maximum 2,000rpm For more details, please contact us or download the catalog.
basic information
【Specifications】 [EHG-170AV/EHG-250NC] ○Work table dimensions: φ170mm/φ250mm ○Rotational speed: Maximum 560rpm/Maximum 300rpm ○Control: PLC/PLC ○Operation panel: LCD soft touch panel 7.4inch/ LCD soft touch panel 12.1inch ○Device size (W×D×H): 1300mm×620mm×1317mm/ 1150mm×780mm×1450mm ○Device weight: 800kgf/900kgf ●For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
For more details, please contact us or download the catalog.
catalog（2）
Download All Catalogs
News about this product（2）
-
We will be exhibiting at the International Conference on Silicon Carbide and Related Materials (ICSCRM 2019). (Event dates: September 30 to October 4, 2019)
Nihon Engis will exhibit at the "International Conference on Silicon Carbide and Related Materials 'ICSCRM 2019'" held from September 30 (Monday) to October 4 (Friday), 2019, at the National Kyoto International Conference Center. 《Exhibition Overview》 Date: 2019/9/30 (Monday) - 10/4 (Friday) Location: National Kyoto International Conference Center Exhibition Booth Number: C35 Official Website: https://www.icscrm2019.org/ We sincerely look forward to welcoming many of you to our booth.
-
We will exhibit at the trade show "SEMICON JAPAN 2017" (Event dates: December 13, 2017 - December 15, 2017).
Nihon Engis will be exhibiting at "SEMICON JAPAN 2017," which will be held from December 13 (Wednesday) to December 15 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping machine, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries regarding polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.
