We will exhibit at the trade show "SEMICON JAPAN 2017" (Event dates: December 13, 2017 - December 15, 2017).

日本エンギス

Nihon Engis will be exhibiting at "SEMICON JAPAN 2017," which will be held from December 13 (Wednesday) to December 15 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping machine, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries regarding polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.

Date and time Wednesday, Dec 13, 2017 ～ Friday, Dec 15, 2017
Capital Venue: Tokyo Big Sight (Tokyo International Exhibition Center)
Entry fee Free

Related product information

Free distribution of the latest catalog for grinding and wrapping equipment!
Demo now available! Everything you need for wrapping equipment is here! Polishing equipment for automobiles and hydraulic machinery is also available.

【Overview of Each Product】 ■ Precision Lapping Equipment Active in a wide range of applications including aerospace, automotive, data storage, and optical communication. Available in 8-inch types for research and development, as well as 12/15-inch options. ■ Multifunctional Polishing System "Trinity-Y" Equipment designed to accommodate next-generation materials such as wide-gap semiconductors. You can select the optimal mechanism for each material. ■ Precision Large Lapping/Polishing Equipment In addition to standard types, options include the GNC series equipped with high-precision facing equipment and bridge-type GNC. ■ Precision Grinding Machine Series A compact vertical grinding machine from the "Trinity-Y" series. Ideal for machining hard and brittle materials, small lot production, and research and development institutions. *For more details, please refer to the comprehensive catalog. Feel free to contact us with any inquiries!
Diamond polishing liquid "High Press Diamond Slurry"
Engis, boasting excellent diamond grading technology, meets user demands with a wide variety of slurries!

High-pressure diamond slurry is an essential product for precision lapping processes. It is adopted mainly in the electronics industry due to its excellent classification accuracy of diamonds and a diverse lineup of special solutions. <Features> - Synthetic single crystal and polycrystalline diamonds are available starting from a minimum of 1/10 micron* - Special solutions include oil-based, water-based, amphoteric, and emulsion options *Size range is from 0 to 0.2 microns □■□■□■□■□■□■□■□■□■□■□■□■ ★For more details, please download and view the materials and catalog. □■□■□■□■□■□■□■□■□■□■□■□■
Ultra-precision single-sided wrapping device 'EJW-460I'
It is a wrapping device capable of being equipped with a fencing device.

For more details, please request the materials.
Vertical Grinding Machine "HVG Series"
It is optimized for small lot production and research and development institutions.

【Specifications】 [HVG-200/HVG-250] ○Rotational Speed: Maximum 20,000 rpm / Maximum 2,000 rpm ○Work Table Dimensions: φ200mm / φ250mm ○Rotational Speed: Maximum 400 rpm / Maximum 450 rpm ○Control: PLC / PLC ○Operation Panel: LCD Soft Touch Panel 7.4 inch / LCD Soft Touch Panel 12.1 inch ○Device Size (W×D×H): 800mm×800mm×1900mm / 1000mm×1100mm×1800mm ○Device Weight: 1,100 kgf / 2000 kgf ●For more details, please contact us or download the catalog.
Double-sided polishing system 'EJD-6BY'
Birth of a multifunctional compact CMP-compatible double-sided polishing device!

For more details, please download and view the materials and catalog.
Horizontal Grinding Machine "EHG Series"
It is possible to achieve processing efficiency and high precision flatness.

【Specifications】 [EHG-170AV/EHG-250NC] ○Work table dimensions: φ170mm/φ250mm ○Rotational speed: Maximum 560rpm/Maximum 300rpm ○Control: PLC/PLC ○Operation panel: LCD soft touch panel 7.4inch/ LCD soft touch panel 12.1inch ○Device size (W×D×H): 1300mm×620mm×1317mm/ 1150mm×780mm×1450mm ○Device weight: 800kgf/900kgf ●For more details, please contact us or download the catalog.