Double-sided polishing system 'EJD-6BY'
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Birth of a multifunctional compact CMP-compatible double-sided polishing device!
A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made with a full stainless steel dust cover and thoroughly uses corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste.
basic information
For more details, please download and view the materials and catalog.
Price range
P6
Delivery Time
OTHER
Model number/Brand name
EJD-6BY-CMP
Applications/Examples of results
Power device substrates (GaN, SiC, etc.) double-sided polishing, sapphire substrates, smartphone components, HDD substrates, etc.
catalog（1）
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News about this product（2）
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We will be exhibiting at the International Conference on Silicon Carbide and Related Materials (ICSCRM 2019). (Event dates: September 30 to October 4, 2019)
Nihon Engis will exhibit at the "International Conference on Silicon Carbide and Related Materials 'ICSCRM 2019'" held from September 30 (Monday) to October 4 (Friday), 2019, at the National Kyoto International Conference Center. 《Exhibition Overview》 Date: 2019/9/30 (Monday) - 10/4 (Friday) Location: National Kyoto International Conference Center Exhibition Booth Number: C35 Official Website: https://www.icscrm2019.org/ We sincerely look forward to welcoming many of you to our booth.
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We will exhibit at the trade show "SEMICON JAPAN 2017" (Event dates: December 13, 2017 - December 15, 2017).
Nihon Engis will be exhibiting at "SEMICON JAPAN 2017," which will be held from December 13 (Wednesday) to December 15 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping machine, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries regarding polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.
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Distributors
Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.