Low-phosphorus electroless nickel plating without sulfur-based additives.
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Sulfur (sulfur) free! It has become possible to maintain long-term solder wettability, which has been a concern until now.
By achieving "no use of sulfur-based additives," which was not possible with conventional low-phosphorus electroless Ni-P plating, it has become possible to maintain the long-term wettability of solder, which has been a bottleneck until now. Due to its excellent uniformity in film thickness, plating can be performed without variation even on shapes such as heat sink fins. 【Features】 - The phosphorus (P) content of the Ni coating is low at 2-4 wt%, resulting in minimal "nickel consumption" during solder joining, enabling highly reliable solder joints. - Since sulfur-based additives are not used, it can maintain long-term wettability of solder, and the resulting plating film has excellent discoloration resistance and acid resistance. - A high hardness coating of Hv680 can be obtained without post-plating heat treatment, providing excellent wear resistance. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Main Plating Coating Specifications】 ■Coating Composition: Ni: 96-98 wt% P: Ni2-4 wt% ■Hardness (Hv): Without Heat Treatment: 680 With Heat Treatment: 900 ■Crystal Structure: Microcrystalline *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Parts that require soldering ■ Parts that require wear resistance but do not tolerate heat treatment after plating, such as copper and aluminum ■ Parts that require general corrosion resistance *For more details, please refer to the PDF document or feel free to contact us.
