Quality assurance for substrates supporting next-generation computing - Supporting the realization of high-reliability products, from advanced package substrates for quantum computers to high-performance substrates for AI servers and ultra-high-speed transmission substrates for optoelectronic integration.

ユーロフィンFQL

As the practical application of quantum computers, AI servers, and optoelectronic fusion systems progresses, printed circuit boards are required to achieve higher density and multilayering than ever before. On the other hand, the miniaturization of wiring spacing and interlayer distances increases the risk that even slight foreign substances or ionic residues can cause insulation failures, leading to short circuits, localized heating, and even burning. Particularly in AI servers and high-speed communication boards, minor insulation degradation can significantly impact the overall reliability of the system. Additionally, after burning, the foreign substances or conductive pathways that caused the issue often disappear, making fault analysis difficult in many cases. Eurofins FQL conducts advanced insulation evaluation tests at the bare board stage before component mounting, visualizing potential risks early on. ✔ Prevention of defects ✔ Improvement of quality and reliability ✔ Reduction of analysis costs and rework hours We support the realization of high-reliability products, from advanced package boards for quantum computers to high-performance boards for AI servers and ultra-high-speed transmission boards for optoelectronic fusion. Please feel free to consult us about the quality of boards that support next-generation technologies.

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Technical Data Set | Reliability Evaluation, Safety Evaluation, Failure Analysis, Analysis
We publish technical materials on reliability assessment, safety evaluation, failure analysis, and analysis!

- Analysis Handbook - Reliability Handbook - Reliability, Functionality, and Safety Evaluation Service Menu
Reliability evaluation test / environmental test
We offer a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests!

[Other feasible reliability tests/environmental tests (partial)] ■ Micro-vibration test ■ Whisker evaluation test ■ Special environmental tests (weather resistance test/gas corrosion test/decompression test) ■ Safety/lifetime and characteristic evaluation of battery units ■ Evaluation of power supply units/AC adapters/failure analysis services
Reliability evaluation and failure analysis of electronic components and substrate materials for AI data centers.
Total support from reliability evaluation of electronic components and circuit boards that support AI data centers to failure analysis and cause investigation.

The features of the FQL service are that "you can consult even at the stage where the testing method has not been decided" and "not only conducting tests but also considering the results to lead to the next actions." ■ Expected Customer Challenges - Want to evaluate the reliability of components for AI servers - Want to conduct tests assuming high temperatures and high loads - Want to investigate the causes of failures in substrates, connectors, power components, etc. - Want to evaluate the quality and degradation of substrate materials and joints - Do not know what kind of evaluation should be conducted ■ Flow of Technical Support Even for themes where evaluation methods have not been established, we will consider evaluation conditions and analysis approaches together. "Confirmation of issues and usage environment" ↓ "Consideration of evaluation methods" ↓ "Reliability testing" ↓ "Failure analysis and substrate material analysis" ↓ "Discussion of causes and failure mechanisms" ↓ "Verification of improvements and countermeasures"