Reliability evaluation and failure analysis of electronic components and substrate materials for AI data centers.
Total support from reliability evaluation of electronic components and circuit boards that support AI data centers to failure analysis and cause investigation.
With the spread of generative AI, AI servers are advancing in high performance, high density, and high power consumption, leading to a greater demand for reliability in electronic components and substrates than ever before. Eurofins supports problem-solving by combining reliability evaluation, environmental testing, failure analysis, evaluation and analysis of substrate materials, and CAE/simulation for semiconductors, substrates and substrate materials, connectors, power supplies and power components, capacitors, memory and SSDs, optical-related components, and more that make up AI data centers. We are available for consultations even at the stage of "not knowing what tests to conduct." We will flexibly propose solutions tailored to your challenges, from examining the usage environment and anticipated failure modes to considering evaluation methods, analyzing causes, and verifying improvements and countermeasures.
basic information
The features of the FQL service are that "you can consult even at the stage where the testing method has not been decided" and "not only conducting tests but also considering the results to lead to the next actions." ■ Expected Customer Challenges - Want to evaluate the reliability of components for AI servers - Want to conduct tests assuming high temperatures and high loads - Want to investigate the causes of failures in substrates, connectors, power components, etc. - Want to evaluate the quality and degradation of substrate materials and joints - Do not know what kind of evaluation should be conducted ■ Flow of Technical Support Even for themes where evaluation methods have not been established, we will consider evaluation conditions and analysis approaches together. "Confirmation of issues and usage environment" ↓ "Consideration of evaluation methods" ↓ "Reliability testing" ↓ "Failure analysis and substrate material analysis" ↓ "Discussion of causes and failure mechanisms" ↓ "Verification of improvements and countermeasures"
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Line up（5）
| Model number | overview |
|---|---|
| Evaluation Design and Technical Consulting | We will confirm the usage environment of the target parts and the anticipated failure modes, and propose the necessary testing and evaluation methods. You can consult us even if you are at the stage of "not knowing what to evaluate." |
| Reliability evaluation and environmental testing | We will conduct reliability evaluations tailored to the usage environment and purpose, focusing on electronic components and circuit boards that make up the AI server, under conditions such as high temperature, high humidity, temperature cycles, and vibrations. |
| Fault analysis and cause investigation | We support the identification of failure points and investigation of causes for defects in semiconductors, substrates, connectors, power components, etc., by combining X-ray, ultrasound, electrical characteristic evaluation, cross-sectional observation, SEM, and other methods. |
| Evaluation/Analysis of Substrates and Substrate Materials | We support the investigation of the causes of quality and reliability issues by evaluating and analyzing the material properties, joints, interfaces, and thermal effects of substrates and substrate materials that support the densification and high performance of AI servers. |
| CAE Simulation | Capable of special simulations such as optics, pressure, shock, vibration, and acoustics. Supports the consideration of failure mechanisms, examination of evaluation conditions, and design improvements in combination with actual measurement evaluations. |
catalog（5）
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News about this product（2）
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Announcement of the publication of the "Electronic Components Failure Analysis and Reliability Evaluation Service Catalog."
We have newly published the "Electronic Components Failure Analysis and Reliability Evaluation Service Catalog." This catalog introduces service menus that assist in investigating the causes of failures and evaluating the reliability of printed circuit boards, connectors, cables, and passive components. Additionally, it includes testing methods for failure analysis and reliability evaluation, as well as actual analysis and evaluation case studies. One of the featured case studies is the hammering micro-vibration test. This test evaluates the risk of contact failure in connectors by reproducing wear caused by minute sliding of the contacts, allowing for the capture of changes in contact resistance and momentary disconnections. The catalog includes comparative evaluation case studies of vibration tests and micro-vibration tests on the same materials, enabling you to see the differences in results obtained from each test. In addition, we have published various tests along with their evaluation and analysis case studies. We encourage you to utilize this catalog when considering outsourcing investigations of electronic component failures or reliability evaluations. We also welcome inquiries regarding evaluations and analyses, so please feel free to contact us.
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Quality assurance for substrates supporting next-generation computing - Supporting the realization of high-reliability products, from advanced package substrates for quantum computers to high-performance substrates for AI servers and ultra-high-speed transmission substrates for optoelectronic integration.
As the practical application of quantum computers, AI servers, and optoelectronic fusion systems progresses, printed circuit boards are required to achieve higher density and multilayering than ever before. On the other hand, the miniaturization of wiring spacing and interlayer distances increases the risk that even slight foreign substances or ionic residues can cause insulation failures, leading to short circuits, localized heating, and even burning. Particularly in AI servers and high-speed communication boards, minor insulation degradation can significantly impact the overall reliability of the system. Additionally, after burning, the foreign substances or conductive pathways that caused the issue often disappear, making fault analysis difficult in many cases. Eurofins FQL conducts advanced insulation evaluation tests at the bare board stage before component mounting, visualizing potential risks early on. ✔ Prevention of defects ✔ Improvement of quality and reliability ✔ Reduction of analysis costs and rework hours We support the realization of high-reliability products, from advanced package boards for quantum computers to high-performance boards for AI servers and ultra-high-speed transmission boards for optoelectronic fusion. Please feel free to consult us about the quality of boards that support next-generation technologies.
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Eurofins FQL Co., Ltd. has its origins in the analysis division of Fujitsu Laboratories Ltd. and the quality assurance department of Fujitsu Ltd. It has long engaged in activities aimed at improving product quality, not only in material analysis, reliability evaluation, safety assessment, and failure analysis, but also in supplier quality management and manufacturing plant audits. Additionally, it contributes to solving challenges faced by organizations responsible for quality through the development and educational support of personnel involved in quality, as well as the construction and improvement of quality management, product chemical substance management systems, and software development processes. ■ Reliability Evaluation and Environmental Testing Various reliability evaluations, safety verification of secondary batteries and power supplies, etc., including smoke and fire hazards. Evaluation of special environments such as weather resistance and gas corrosion. ■ Failure Analysis Failure analysis of electronic components and devices, confirmation of characteristics related to materials, and detailed analysis of defects. ■ Support for Building and Improving Quality-Related Systems and Processes To achieve QCD (Quality, Cost, Delivery) goals, we support the improvement of development processes using models such as CMMI and Automotive SPICE. ■ Quality-Related Education Customized educational programs tailored to specific challenges, such as "I want to revitalize the organization," "I want to cultivate a quality mindset," and "I want to provide quality education for new employees."