Circuit components (resistors, capacitors, transistors, diodes, etc.)
Circuit components (resistors, capacitors, transistors, diodes, etc.)
We will extract and propose appropriate reliability evaluation and testing content based on the anticipated failure modes. We also accept failure analysis. - Reflow heat resistance test - Temperature cycle test - High-temperature storage test - High-temperature and high-humidity bias test and more.
1～10 item / All 10 items
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Commissioned Testing | Standard Testing for Household and Commercial Electrical Products - JIS, UL, IEC, etc.
Are you having trouble conducting the necessary standard tests for the sale of new products? We offer testing services for public standards applicable to household and commercial electrical products!
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Applied Contract Testing | Reliability Evaluation Testing, Environmental Testing, Failure Reproduction Testing
I hope the test conditions cannot be implemented with the conventional testing equipment! It is not possible to conduct failure reproduction experiments that take multiple conditions into account. Have you ever had such an experience?
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Failure analysis of electronic devices and components
From investigating the mechanisms of failures and malfunctions to proposing improvement measures and verifying their effectiveness, our expert engineers provide total support!
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Reliability evaluation test / environmental test
We offer a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests!
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Technical Data Set | Reliability Evaluation, Safety Evaluation, Failure Analysis, Analysis
We publish technical materials on reliability assessment, safety evaluation, failure analysis, and analysis!
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Accelerated degradation testing services for electronic devices
We will "materialize" and propose/implement accelerated aging tests suitable for the product! Leave the accelerated aging tests to us.
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Destructive analysis (material analysis, fracture surface analysis, FIB, TEM, etc.)
We will conduct failure analysis of electronic components and observe and analyze the failure locations through material analysis.
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Non-destructive analysis and non-destructive testing (lock-in thermography, ultrasonic testing)
We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.
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Power Cycle Test | Reliability Evaluation of Power Modules and Power Devices
Reliability evaluation of power modules and power devices. We offer proposals from the construction of test environments tailored to your power cycle specifications to investigation and analysis!
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Destructive analysis | Power module package opening (decap)
Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?
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