Destructive analysis | Power module package opening (decap)
Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?
Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.
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Upon request, we can provide post-opening analysis, evaluation, and other responses such as: - Visual inspection - SEM observation - SEM-EDX analysis, etc.
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Eurofins FQL Co., Ltd. has its origins in the analysis division of Fujitsu Laboratories Ltd. and the quality assurance department of Fujitsu Ltd. It has long engaged in activities aimed at improving product quality, not only in material analysis, reliability evaluation, safety assessment, and failure analysis, but also in supplier quality management and manufacturing plant audits. Additionally, it contributes to solving challenges faced by organizations responsible for quality through the development and educational support of personnel involved in quality, as well as the construction and improvement of quality management, product chemical substance management systems, and software development processes. ■ Reliability Evaluation and Environmental Testing Various reliability evaluations, safety verification of secondary batteries and power supplies, etc., including smoke and fire hazards. Evaluation of special environments such as weather resistance and gas corrosion. ■ Failure Analysis Failure analysis of electronic components and devices, confirmation of characteristics related to materials, and detailed analysis of defects. ■ Support for Building and Improving Quality-Related Systems and Processes To achieve QCD (Quality, Cost, Delivery) goals, we support the improvement of development processes using models such as CMMI and Automotive SPICE. ■ Quality-Related Education Customized educational programs tailored to specific challenges, such as "I want to revitalize the organization," "I want to cultivate a quality mindset," and "I want to provide quality education for new employees."