Non-destructive analysis and non-destructive testing (lock-in thermography, ultrasonic testing)
We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.
In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Support Overview】 ■Detailed Analysis ■Cause Estimation ■Reproduction Verification ■Occurrence Prediction ■Fundamental Countermeasures ■Others (Prevention of Recurrence, Horizontal Deployment, etc.) *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
