ユーロフィンFQL Official site

Destructive analysis | Package opening (decapping)

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

Related Link - https://www.eurofins.co.jp/efql/

basic information

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Applications/Examples of results

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Destructive analysis | Semiconductor package opening (decap)

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Power module resin opening analysis service

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LSI failure analysis service

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Eurofins FQL Co., Ltd. has its origins in the analysis division of Fujitsu Laboratories Ltd. and the quality assurance department of Fujitsu Ltd. It has long engaged in activities aimed at improving product quality, not only in material analysis, reliability evaluation, safety assessment, and failure analysis, but also in supplier quality management and manufacturing plant audits. Additionally, it contributes to solving challenges faced by organizations responsible for quality through the development and educational support of personnel involved in quality, as well as the construction and improvement of quality management, product chemical substance management systems, and software development processes. ■ Reliability Evaluation and Environmental Testing Various reliability evaluations, safety verification of secondary batteries and power supplies, etc., including smoke and fire hazards. Evaluation of special environments such as weather resistance and gas corrosion. ■ Failure Analysis Failure analysis of electronic components and devices, confirmation of characteristics related to materials, and detailed analysis of defects. ■ Support for Building and Improving Quality-Related Systems and Processes To achieve QCD (Quality, Cost, Delivery) goals, we support the improvement of development processes using models such as CMMI and Automotive SPICE. ■ Quality-Related Education Customized educational programs tailored to specific challenges, such as "I want to revitalize the organization," "I want to cultivate a quality mindset," and "I want to provide quality education for new employees."