[Technical Information] Information on the assembly and bonding of optical package products has been made available for free!
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In the assembly (mounting and bonding) of optical package products, it is necessary to align optical components and electronic components with the highest precision. Furthermore, in cases such as products that incorporate thermoelectric coolers (TECs), the assembly process becomes even more complex. This technical paper explains the assembly of general printed circuit board (PCB) based optical transceiver modules (40 Gbit/s to 400 Gbit/s) for data communication applications, specifically QSFP (Quad Small Form-factor Pluggable). We hope you find it helpful!
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