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[Technical Information] We have released bonding using anisotropic conductive adhesive for free!

ファインテック日本

ファインテック日本

In today's world, it is unimaginable to think of a scenario without technologies like Flex-on-Glass, which electrically connects flexible printed circuit boards to glass substrates, or Chip-on-Glass, which directly bonds chips to glass. These technologies utilize anisotropic conductive films and pastes that have different functional principles compared to conventional adhesives and solder materials, requiring appropriate processing. This technical paper introduces these technologies and discusses typical challenges and proven solutions. We hope you find it helpful!

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