[Example] Thermal conduction and thermal stress coupled analysis of circuit boards 'AIFEM'
Quickly model electronic circuit structures using AIFEM! Evaluate the rationality of temperature and stress distribution.
We would like to introduce a case study of thermal stress coupled analysis of circuit boards using the general-purpose finite element analysis software "AIFEM." Thermal stress analysis plays a crucial role in optimizing the thermal design of products, especially for high-power heating electronic components and devices, thereby enhancing the reliability of electronic equipment. By utilizing AIFEM, we quickly modeled the electronic circuit structure, created thermal transfer and heat source models, and evaluated the rationality of temperature and stress distribution. [Case Overview] ■ Volume heat source (target red area): 1.5 [mW/mm3] ■ Volume heat source (target orange area): 1.0 [mW/mm3] ■ Surface heat dissipation condition: heat transfer coefficient 0.01 [mW/(mm2*K)] ■ Ambient temperature (target blue area): 20 [℃] *For more details, please download the PDF or feel free to contact us.
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