[Case Study] Cooling Performance Analysis of Water-Cooled Plates 'AICFD'
We will introduce a case where two heat sources were installed on a cooling plate and the cooling performance was evaluated.
We would like to introduce a case study analyzing the cooling performance of a water-cooled plate using the general-purpose thermal fluid analysis software "AICFD." Two heat sources (silicon chips) were installed on the cooling plate (aluminum alloy) to evaluate its cooling performance. Our company offers a wide range of services, including product design, simulation analysis, performance optimization, customization development of software and platforms, and secondary development of commercial software. 【Analysis Conditions】 ■ Inlet Conditions: Velocity 0.2 [m/s], Temperature 25 [℃] ■ Turbulence Model: Laminar Flow ■ Heat Generation ・Heat Source 1: 40 [W] ・Heat Source 2: 60 [W] ■ Thermal Resistance: 0.25 [K/W], 0.167 [K/W] *For more details, please download the PDF or feel free to contact us.
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