[Case Study] Water Cooling Analysis of IGBT Module 'AICFD'
You can understand the pressure loss of the heat sink water jacket!
We will introduce a case study analyzing the cooling performance of a water-cooled IGBT module using the general-purpose thermal fluid analysis software "AICFD." The model being analyzed is a simplified version, representing 1/6 of the original module. Additionally, a water-cooled heat sink has been added to the underside of the substrate, and the mesh model consists of 8.78 million unstructured cells. By conducting such analyses, we can understand the pressure loss of the heat sink water jacket and the cooling state of the module, which provides valuable information for thermal design and thermal countermeasures. 【Boundary Conditions】 ■ Inlet Velocity (m/s): 8.0 ■ Inlet Water Temperature (K): 295.14 ■ Water Side Heat Exchange Area (m²): 4.062×10^-3 *For more details, please download the PDF or feel free to contact us.
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【Heat Source Conditions】 ■IGBT Chips (4 pieces) ・Heat Generation (W): 1,037.5 ・Heat Generation Rate (mW/mm³): 5.12×10³ ■Diode Chips (2 pieces) ・Heat Generation (W): 1,300.0 ・Heat Generation Rate (mW/mm³): 6.41×10³ *For more details, please download the PDF or feel free to contact us.*
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Our company focuses on the development, sales, and support of various CAE software with "AI x Optimization" as a key concept, and we offer a wide range of services including contract analysis and consulting. The software we provide can also be customized according to our customers' requests. We aim to contribute to manufacturing by providing better products and services in product development, design, and research.