• Magazine stick(7)

  Since the late 1950s, when engineering plastics (especially PC) were introduced and began to spread in Japan, our company has been dedicated solely to the extrusion molding of engineering plastics. We have consolidated our advanced extrusion molding technology, cultivated over many years, to design and manufacture high-quality and reliable engineering plastic magazine sticks for automatic insertion machines for electronic components.

• Moisture-proof insulating paint(6)

  The implementation density of printed circuit boards, which serve as the heart of electronic devices, is increasingly high, and the spacing between patterns is tending to become narrower. Moreover, issues that were not previously considered problematic, such as the adhesion of foreign substances like moisture, condensation, oil, detergents, mold, insect remains, and dust, as well as malfunctions or disconnections caused by vibrations, have begun to be recognized as problems. The moisture-proof insulating coating Seal-glo forms a thin film upon drying at room temperature, which is highly excellent in moisture resistance and electrical properties. I am confident that it will further enhance the reliability of electronic devices, starting with conformal coating for various printed circuit boards and serving as a moisture-proof insulating seal for various electronic components.

• Joint tape(5)

  With the proliferation of implementation machines, has the increased frequency of reel exchanges become a problem due to production downtime, and is the management of remaining tape an issue due to the increase in the types of surface-mounted components? The joint tape we sell focuses on these problems and simplifies the cumbersome connection work for carrier tape for chip parts, regardless of location.

• Adhesive for fixing chip components(2)

  The Seal-glo NE series is an adhesive developed for temporarily fixing chip components. It is a one-component, heat-curing epoxy adhesive that excels in storage stability. The Seal-glo NE series not only has fast curing properties at temperatures of 120 to 150°C in just 1 to 2 minutes, which is required for SMD mounting, but also offers various grades that excel in high-speed dispensing and fine printing to meet your needs.

Product/Service List (30)